| 发明名称 |
COPPER SOURCE REAGENT COMPOSITIONS, AND METHOD OF MAKING AND USING SAME FOR MICROELECTRONIC DEVICE STRUCTURES |
| 摘要 |
Copper precursors useful in liquid delivery CVD for forming a copper-containing material on a substrate. The disclosed copper precursors are particularly useful for metallization of interconnections in semiconductor device structures. |
| 申请公布号 |
EP1185538(A4) |
申请公布日期 |
2002.07.24 |
| 申请号 |
EP20000932701 |
申请日期 |
2000.05.22 |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
XU, CHONGYING;BAUM, THOMAS, H. |
| 分类号 |
C07C49/92;C07F1/00;C07F1/08;C07F7/08;C23C16/18;H01L21/28;H01L21/285;(IPC1-7):C07F1/08;B05D5/12;H01B1/02;B32B15/20;H01L21/00 |
主分类号 |
C07C49/92 |
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