| 摘要 |
PURPOSE: A semiconductor device, manufacturing method and apparatus for the same are provided to produce a highly reliable semiconductor chip electrode structure that can control interface reaction of bonding sections without using solder of a multiple alloy metallic composition with many microscopic elements. CONSTITUTION: On wiring(2) of a semiconductor chip(1), an electrode is formed, which is composed of a contact layer(4) for obtaining intimate contact with a metal constituting the wiring(2), an UBM(under bump metal) layer(5) turned into alloy through reaction with solder, and a solder alloy making layer thinly formed using metal that is different to the UBM layer(5) allowed to be alloyed with the solder. A two-element or three-element solder ball with tin as a main component and containing no lead is supplied onto this electrode. |
