| 摘要 |
PURPOSE: A super slim type layered semiconductor chip package and a lead frame used for the same are provided to increase the mounting density of a semiconductor device as well as decrease a thickness of the layered type package device while using a present plastic package assembling process and equipment. CONSTITUTION: The lead frame includes the first die pad(21) attached by the first semiconductor chip(30), the first tie bar(31) fixing the first die pad by connecting to the first die par mechanically, the second die pad(23) attached by the second semiconductor chip(40), the second tie bar(35) fixing the second die pad by connecting to the second die par mechanically, and a plurality of leads placing around the first and second die pad and connecting to the first and second semiconductor chip electrically. The first tie pad includes a downward bent part(37) and the second tie pad includes an upward bent part(33). The first and the second die pad are separated by the spacing in order not to overlap with each other. Then, the first and the second die pad are placed on the spacing in order that the first and the second semiconductor chip are overlapped with each other.
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