| 摘要 |
<p>PURPOSE: To obtain a semiconductor device excellent in heat dissipation properties and reliability in which thermal strain is reduced at the time of manufacture or operation while protecting each member against deformation, denaturation and rupture. CONSTITUTION: The semiconductor device comprises a metal bonded circuit board 122 produced by bonding a ceramics and metal plates 13a-13c integrally while forming a circuit pattern by means of the metal plates 13a-13c, a semiconductor substrate 101 mounted on the circuit pattern, and a supporting member 125 made of a matrix metal dispersed with inorganic ceramic powder and brazed to the metal bonded circuit board 122 on the side opposite to the semiconductor substrate 101. With such structure, thermal strain is suppressed at the time of manufacture or operation while protecting each member against deformation, denaturation and rupture and an electronic apparatus excellent in heat dissipation properties and reliability can be obtained while reducing power consumption.</p> |
