| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a flex rigid wiring board capable of surely preventing the dissolution of a film cover lay layer accompanying the coarsening processing of a via hole resist layer. SOLUTION: This manufacture is provided with a process for laminating an adhesive material layer 5 where the opening 8 of a size corresponding to the conductor wiring 1 of a flexible cable part B is formed onto the film cover lay layer 4, the process for laminating an outer side core base material 6 where an oblong hole 9 in a direction matched with the surrounding edge of the opening 8 is formed at the boundary position of a rigid multi-layer part A and the flexible cable part B at an outer side position from the surrounding edge of the opening 8 formed on the adhesive material layer 5 onto the adhesive material layer 5, the process for laminating the via hole resist layer 7 onto the outer side core base material 6 for constituting the rigid multi-layer part A and then coarsening the via hole resist layer 7 and the process for covering the opening 8 of the adhesive material layer 5 and then removing a part 6a corresponding to the opening positioned between the oblong hole 9 among the outer side core base material 6 laminated on the adhesive material layer 5. |
