发明名称 SUBSTRATE-PROCESSING DEVICE AND ITS METHOD
摘要 PURPOSE: To reduce an effect exerted upon a substrate on carrying by particles produced during the operation of a lifting mechanism of a carrying means, in the carrying means for the substrate installed inside a substrate-processing device. CONSTITUTION: A partition wall having a slit-shaped opening is made in a box forming an exterior of the lifting mechanism to separate a first chamber and a second chamber. A carrying body for holding a wafer is fixed by a bar- shaped support and the end of the support is supported by a guide shaft. A drive mechanism for vertically moving the guide shaft and the support are provided in the first chamber and the support is vertically moved along the guide shaft. A fan is provided in the second chamber and an exhaust port is made in a bottom surface. When the fan is operated, atmosphere in the first chamber is sucked via the opening in the partition wall to discharge the particles produced when the carrying body is vertically moved through the second chamber from the exhaust port.
申请公布号 KR20020061515(A) 申请公布日期 2002.07.24
申请号 KR20020001963 申请日期 2002.01.14
申请人 TOKYO ELECTRON LIMITED 发明人 IIDA NARUAKI
分类号 B65G49/00;B65G49/06;B65G49/07;H01L21/00;H01L21/027;H01L21/677;(IPC1-7):H01L21/027 主分类号 B65G49/00
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