| 摘要 |
PURPOSE: A stacked semiconductor package is provided to increase the capacity of the package by stacking the chips having a same size and to achieve a slim structure. CONSTITUTION: The stacked semiconductor package comprises a lead frame(130) having a chip mounting part(132) at one inner side part of each lead(131) and a land part(134) to one outer side part of each lead by forming the inner part of each lead thinner than the outer part, the first and the second chip(110,120) respectively installing to the chip mounting part of each lead and the other side of each lead, a connection tool connecting the respective chips with the lead frame electrically, and a molding compound(180) protecting the connection tool from the outside. |
