Silicon semiconductor diode, its circuit module and structure with an insulation body and preparation method thereof

摘要

An insulation body structure (1) with connected units on which multiple mounting sites for diode chips (3) are prepared. Each diode chip is located in one of the mounting sites (1a) and is coated and packaged with bonding material (2). A plurality of diode chips may be assembled in the insulation body structure in one single step. The following processes may take place on the connected insulation body structure. Units of single or plural diodes are separated after the preparation process is completed. The structure of the diode chip-insulation body assembly is a direct construction of diode.