| 摘要 |
PURPOSE: A preparation process of water soluble flux and oil used during soldering by horizontal hot air leveler method is provided to prepare water soluble flux and oil used in soldering coating by hot air leveler method among various methods protecting a circuit part formed of copper or copper alloy of a printed circuit board. CONSTITUTION: The water soluble flux and oil is characterized in that the water soluble flux comprises 20 to 70 wt.% of surfactant, 0.1 to 105 wt.% of organic acid and inorganic acid, 1 to 205 wt.% of alcohol and glycols and 1 to 50 wt.% of water, and the oil comprises 80 to 100 wt.% of surfactant and 0.1 to 20 wt.% of antioxidant, wherein the water soluble flux and oil contains one or more compounds selected from a compound to which 10 to 20 moles of oxide ethylene is added from polyoxyethylene nonylphenyl ether, a compound to which 5 to 15 moles of oxide ethylene is added from polyoxyethylene alkylether(polyoxyethylene lauryl ether, polyoxyethylene oleylcetyl ether, polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether), a compound to which 5 to 10 moles of oxide ethylene is added from polyoxyethylene glycol fatty acid ether(polyoxyethylene monolaurate, polyoxyethylene monooleate, polyoxyethylene monostearate, polyoxyethylene caster oil), and a compound to which 5 to 30 moles of ethylene oxide and propylene oxide is added from polyoxyethylene glycol ester and polyoxypropylene glycol ester in order to improve wettability and water washability.
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