发明名称 Surface reformation method of high polymer material
摘要 There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
申请公布号 US6423405(B1) 申请公布日期 2002.07.23
申请号 US19990384105 申请日期 1999.08.27
申请人 HITACHI, LTD. 发明人 SHIBUYA TSUTOMU;KATAYAMA KAORU;SHIRAI MITUGU;KAZUI SHINICHI;SASAKI HIDEAKI;IWATA YASUHIRO
分类号 C08J7/00;H01L21/56;H01L21/60;H01L21/68;H05K3/22;H05K3/30;H05K3/34;(IPC1-7):B32B7/12 主分类号 C08J7/00
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