发明名称 DEVICE AND METHOD FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a device for laser beam machining with which a work to be machined is precisely cut without a molten part or a crack which is deviated from a planned cutting line on the surface of the work to be machined. SOLUTION: The device is provided with a laser beam source 101 which emits a pulse laser beam of which pulse width is 1μs smaller, a power adjustment part 401 which adjusts the magnitude of the power of the pulse laser beam, a lens selection mechanism 403 including a plurality of condenser lenses which condense the pulse laser beam so that the peak power density at the focal point P of the pulse laser beam becomes 1×108 (W/cm2) or larger, a Z-axis stage 113 with which the focal point P of the pulse laser beam condensed with the condenser lenses is positioned inside the work 1 to be machined, and an X (Y)-axis stages 109 (111) which relatively moves the focal point P along the planned cutting line 5 of the work 1 to be machined. The respective aperture numbers of optical system including the condenser lenses 105a to 105c are different from one another. The dimension of a property modification spot formed inside the work 1 to be machined is controlled by adjusting the aperture number and the magnitude of the power of the pulse laser beam. The dimension is displayed prior to the machining with the laser beam.</p>
申请公布号 JP2002205181(A) 申请公布日期 2002.07.23
申请号 JP20010278665 申请日期 2001.09.13
申请人 HAMAMATSU PHOTONICS KK 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENJI;UCHIYAMA NAOKI;WAKUTA TOSHIMITSU
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/04;B23K26/06;B23K26/40;C03B33/08;(IPC1-7):B23K26/00 主分类号 B23K26/00
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