发明名称 Silent heat exchanger and fan assembly
摘要 A heat dissipation device comprising a thermally conductive, hollow housing having a fan and an active anti-noise module disposed within the hollow housing. The hollow housing may include a plurality of fins disposed therein to increase the surface area for convective heat transfer. The heat dissipation device further may further include heat pipes for the transportation and dispersion of heat to and about an external surface of the hollow housing.
申请公布号 US6422303(B1) 申请公布日期 2002.07.23
申请号 US20000524798 申请日期 2000.03.14
申请人 INTEL CORPORATION 发明人 ISHIDA KENZO;ENDO SHINYA;NELSON DARYL J.
分类号 G06F1/20;G10K11/178;H05K7/20;(IPC1-7):F28F7/00 主分类号 G06F1/20
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