Power module with closely spaced printed circuit board and substrate

摘要

A power module has a printed circuit control component board disposed atop an IMS with an opening in the printed circuit board exposing the top surface of the IMS and power semiconductor die mounted thereon. The top surface of the IMS is closely spaced to the top surface of the printed circuit board so that wire bonds have a reduced drop from the printed circuit board to the IMS. The IMS may be cemented to the periphery of the opening in the printed circuit board, or may be located toward the top of an opening in an insulation support shell which receives a mesa from a support heat sink, which permits the close spacing of printed circuit board and IMS.