发明名称 |
MMIC power amplifier with wirebond output matching circuit |
摘要 |
A hybrid microwave and millimeter wave integrated circuit (MMIC) RF power amplifier includes an integrated circuit in which an amplifier circuit is fabricated and an output impedance matching network comprising metal-insulator-metal (MIM) capacitors mounted on the integrated circuit chip with bonding wire inductors connecting the amplifier circuit with the capacitor elements. The resulting structure has a smaller form factor as compared to conventional power amplifiers employing planar transmission lines and surface mount technology capacitors.
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申请公布号 |
US6424223(B1) |
申请公布日期 |
2002.07.23 |
申请号 |
US20010765996 |
申请日期 |
2001.01.19 |
申请人 |
EIC CORPORATION |
发明人 |
WANG NANLEI LARRY;HSIAO SHUO-YUAN;SUN XIAO-PENG |
分类号 |
H01L23/66;H03F1/56;(IPC1-7):H03F3/60 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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