| 摘要 |
A method and apparatus for packaging microprocessors and memory devices on a single silicon substrate is described. Microprocessors and memory devices are placed on both sides of the silicon substrate. Through holes are formed in the substrate to connect the microprocessor and memory devices together. By packaging the microprocessor and memory element this way, the propagation length between the memory and the microprocessors is shortened, and timing skews are minimized, and data transmission speed is increased. In addition, additional active and passive circuits and/or components can also be fabricated in one or both sides of the silicon substrate. |
