| 摘要 |
An interlace grid array package structure and method of manufacture that utilizes a single sided molding method whose connection with an integrated circuit board is through the underside of the package's plastic body. Therefore, only the alternating contact points arranged into a grid array are exposed for connection after a surface mount operation. Hence, the leads of a lead frame are not protrudent. Therefore, the problem of bent leads is eliminated and the overall package area and thickness is reduced. Since the alternating contact point design of a grid array package increases connection pitch, short-circuiting of neighboring contact points is greatly reduced and a higher yield is obtained. |
