| 摘要 |
An abrasive machine is capable of solving the liquation of metal ions, and improving abrading accuracy. In the abrasive machine, an abrasive plate has an abrasive face capable of abrading a wafer. A holding section includes: a head member located above the abrasive face; a holding plate provided between the head member and the abrasive face, the holding plate having a holding face capable of holding the wafer; and a bellows fixed between the holding plate and the head member, the bellows allowing the holding plate to move close to and away from and incline with respect to the head member, the bellows forming a pressure chamber. Pressing means presses the wafer onto the abrasive face, with the holding plate, by pressurizing the pressure chamber. The bellows is made by cutting a block of plastic without forming seams. |
