| 摘要 |
An IC chip 1 is a flip chip type, which defines a main surface as a mounting surface that is externally exposed and is provided with external terminals 15 on pads 14. An IC chip 2 within a sealant member 6 is stacked on a rear surface of the IC chip 1 through an insulation adhesive member 3. A wiring substrate 4 for the IC chip 2 is provided around the IC chip 1. The wiring substrate 4 includes a base substrate 41 and an insulation film 43 having a conductive pattern 42 provided thereon. Specified portions of the conductive pattern 42 are connected respectively to pads 21 on the IC chip 2 by, for example, bonding wires 5. External terminals 45 for the IC chip 2 connect to a plurality of vias 44 in the wiring substrate 4. The above structure provides a semiconductor device that can achieve a thinner package while maintaining the reliability of each of the stacked IC chips at a high level.
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