| 摘要 |
This invention is concerning a method of manufacturing diodes with ceramic base. It includes cutting grooves on the base to form hundreds of units; forming lower layer conductors on each units of the base; printing resistors and dice adhering to the base; coating the base with covering materials. After processed, salient on the dice tip is revealed, and then it is printed or plated with conductors. In this way, upper layer conductors are formed in order to link it to the border of each unit. Based on the brittle property of the base, it is cleaved into elongated rectangular blocks. Besides, terminals on the lateral are formed. After cauterized, they break into a single diode by automatism based on brittle property of the base. It is characterized that the base of the dice adhered to the lower layer conductors, a flat-shift vibrator can be applied to adhere the base of the dice to the lower layer conductors so as to benefit to the automatic manufacturing.
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