Leadframe for molded semiconductor package and semiconductor package made using the leadframe

摘要

A leadframe and molded semiconductor package made using the leadframe are disclosed. The leadframe includes leads extending from a dam bar toward a central chip mounting region. A pseudo tie bar extends diagonally from three of the four corners of the dam bar toward the chip mounting region. A resin introduction slot is at the remaining corner of the dam bar. The resin introduction slot is wider than a space between adjacent leads. The leads adjacent to the resin introduction slot increase in width as they extend from the dam bar toward the chip mounting region. The leadframe is used to form a semiconductor package having a package body formed of a molded resin. The leadframe design minimizes voids and damage caused by the molding process.