| 摘要 |
To improve the moisture resistance of a chip size package, a seal ring 4 is made up of tungsten plugs and metal electrodes 11 and 12. Further, a spacer is formed on both or either of a first flank 13 and a second flank 14. The spacer can be formed on all interlayer insulating films extended to a dicing line part 3, whereby multiple seal rings can be provided. |
