| 摘要 |
A gold wire, for semiconductor element connection, consisting of 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, 1-100 ppm by weight of Y and preferably 1-100 ppm by weight of at least one from among rare earth elements other than Y, as well as 1-100 ppm by weight of at least one from among Mg, Ti and Pb, the total amount of these elements being no greater than 200 ppm by weight, the balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire. |
