发明名称 CHIP FUSE
摘要 PROBLEM TO BE SOLVED: To stably fuse it by an abnormal current, and make it nonfusible by a rush current by arranging terminal electrodes on both ends of a glass- ceramic substrate where a diamond film is formed on a surface, and laying and forming a fuse element film having a fusible extremely thin part. SOLUTION: A diamond film 2 having a thickness of 5 to 100μm and high heat capacity is laid in an area forming at least a fuse element film 3 on a surface of a glass-ceramic substrate 1. The fuse element film 3 which extends in the lengthwise direction of the substrate 1 and has a fusible extremely thin part, is also formed on a surface of the diamond film 2. Then, when a rush current and an abnormal current flow, the fuse element film 3 is heated, but this is dispersed to the highly heat conductive diamond film 2 side. Therefore, a temperature rise in the fuse element film 3 becomes gentle. That is, when the rush current and the abnormal current are generated, a heating temperature rise in the fuse element film can be delayed by high heat conductivity and high heat accumulating performance of the diamond film 2.
申请公布号 JPH10162715(A) 申请公布日期 1998.06.19
申请号 JP19960318101 申请日期 1996.11.28
申请人 KYOCERA CORP 发明人 INAGAKI MASANAGA;KIYOHARA TOSHIFUMI
分类号 H01H85/08;H01H85/0445;H01H85/045;H01H85/046;H01H85/06;H01H85/17;(IPC1-7):H01H85/08 主分类号 H01H85/08
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