| 摘要 |
PROBLEM TO BE SOLVED: To provide a device of affixing a wafer capable of shortening time required for affixing the wafer onto an affixing table as much as possible in affixing the wafer at a predetermined position of a positioned carrier plate. SOLUTION: When the wafer is affixed on the flat plate shaped carrier plate 24 placed on a heating table 12 and preheated to the predetermined temperature as a previous process for polishing one surface of the wafer, a mark 32 provided at the predetermined position of the carrier plate 24 is detected by a sensor 40 on the heating table 12 for preheating the carrier plate 24 to the predetermined temperature. The carrier plate 24 is positioned based on the position of the mark 32, the carrier plate 24 is transferred to a wafer affixing process by a transfer device while keeping the positioning condition of the carrier plate 24, and then the wafer is affixed on the predetermined position of the carrier plate 24. |
