发明名称 TERMINAL BONDING APPARATUS FOR SYNTHETIC RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To solve such a problem that a conventional apparatus has such a structure that a lower mold consists of a lower mold main body and a pair of block molds and an upper mold member consists of a lower mold part main body, a pair of block molds and an upper mold main body and the structure of the lower mold member becomes complicated, and the upper mold main body of the upper mold member is temporarily united with the lower mold main body held to a loosely fitted state with respect to the lower mold member and a pair of the block molds and, thereafter, the block molds of the lower mold member are united and the upper mold main body of the upper mold member is united and the moving direction of the upper and lower mold members becomes complicated and the complication of the constitution and the movement causes trouble. SOLUTION: The terminal bonding apparatus of a molding is composed of a pair of lower and upper molds and a hot plate and a pair of the lower molds are constituted of one lower mold, one other lower mold moved in an X-direction, other lower mold moved in a Y-direction, one other lower mold and other lower mold moved in an XY direction. A pair of the upper molds are constituted of one upper mold capable of being united with one lower mold and moved in a Z-direction and other upper mold capable of being united with the other lower mold and moved in the Z-direction, and the hot plate can be moved in the X-direction to be inserted in the gap between a pair of the lower molds and a pair of the upper molds. The constitution of the lower and upper molds are simplified to certainly and smoothly weld and fix the terminals of moldings.
申请公布号 JP2002205334(A) 申请公布日期 2002.07.23
申请号 JP20010002088 申请日期 2001.01.10
申请人 FUJI KOGYO KK 发明人 NAKANE KATSUYUKI
分类号 B60J1/18;B29C65/02;(IPC1-7):B29C65/02 主分类号 B60J1/18
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