Ultra high fin density heat sink for electronics cooling

摘要

The present invention is directed to liquid-cooled or air-cooled metallic heat sinks formed as unibody structures that include a planar base and upright fins. The fins are located on one side of the heat sink and the ratio of fin spacing to fin height is low. In order to achieve low value of the ratio of fin spacing to fin height, a fin density of greater than about twelve fins per centimeter is employed. The length of the fins in the flow direction is restricted in order to yield high rate of heat dissipation from the finned surface. Furthermore, flow of the cooling fluid over the fins is maintained laminar in order to reduce the noise level and pumping power for the fluid.