发明名称 Slurry useful for wire-saw slicing and evaluation of slurry
摘要 Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa.second at a shear speed of 2/second and of 50-300 mPa.second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.
申请公布号 US6422067(B1) 申请公布日期 2002.07.23
申请号 US20000637752 申请日期 2000.08.11
申请人 SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORPORATION;OHTOMO CHEMICAL INDUSTRIAL CORPORATION 发明人 OISHI HIROSHI;ASAKAWA KEIICHIRO;MATSUZAKI JUNICHI;ASHIDA AKIO
分类号 B24B57/02;B24B27/06;B28D1/02;B28D5/00;B28D5/04;G01N11/14;G01N33/28;(IPC1-7):G01N11/14;B23D1/04;B23D25/02;G01N19/02 主分类号 B24B57/02
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