发明名称 |
Method and apparatus for drying substrate plates |
摘要 |
While being transferred in substantially horizontal state along a predetermined path of transfer by a conveyer means, a substrate plate is dried by a jet of compressed air which is spurted out from a slit-like mouth of an air knife nozzle crosswise of the entire width of the substrate plate and at a predetermined angle of incidence with respect to a drying surface of the substrate plate to scrape off a liquid. The angle of incidence of jet air is made shallower as soon as the substrate on the conveyer means comes to a point of entry to an air blasting zone and is made deeper at latest when the substrate plate comes to a position immediately before a point of disengagement from the air blasting zone.
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申请公布号 |
US6421932(B2) |
申请公布日期 |
2002.07.23 |
申请号 |
US20010780498 |
申请日期 |
2001.02.12 |
申请人 |
HITACHI ELECTRONICS ENGINEERING CO., LTD. |
发明人 |
GOMMORI KAZUHIKO;KINOSHITA KAZUTO;AKIBA ISAMU;SUGIYAMA MASAO |
分类号 |
F26B5/14;F26B15/12;F26B21/00;(IPC1-7):F26B3/00 |
主分类号 |
F26B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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