发明名称 Mixed memory integration with NVRAM, dram and sram cell structures on same substrate
摘要 A semiconductor memory device including an NVRAM cell structure, a DRAM cell structure and an SRAM cell structure. The NVRAM cell structure, the DRAM cell structure, and the SRAM cell structure are on the same semiconductor on insulator substrate. An NVRAM cell structure. Processes for forming a memory structure that includes NVRAM, DRAM, and/or SRAM memory structures on one semiconductor on insulator substrate and processes for forming a new NVRAM cell structure. Preferably, the semiconductor-on-insulator substrate is an SOI substrate, a silicon on glass substrate or a silicon on sapphire substrate, as appropriate for a particular application.
申请公布号 US6424011(B1) 申请公布日期 2002.07.23
申请号 US19990387059 申请日期 1999.08.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ASSADERAGHI FARIBORZ;HSU LOUIS LU-CHEN;MANDELMAN JACK A.
分类号 G11C11/00;H01L21/8242;H01L21/8247;H01L27/105;H01L27/108;H01L27/115;(IPC1-7):H01L27/01;H01L27/12 主分类号 G11C11/00
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