发明名称 APPARATUS FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To simplify the structure and miniaturize a device and to provide an apparatus for treating a substrate, with which a uniform treating liquid is supplied onto the substrate from plural treating liquid supplying sections provided at a treating section. SOLUTION: The apparatus for treating the substrate has a treating section 5 which accommodates the substrate W and executes a prescribed treatment to the substrate W, a cabinet section 2 being a first treating liquid producing section, which communicates with a plurality of liquid supplying sources and produces a first treating liquid Qm by using a plurality of reagents, a second treating liquid producing section 10 which produces a second treating liquid QM by using the first treating liquid Qm from the cabinet section 2 and pure water from a pure water supplying source, a first supplying section S1 which is provided in a treating section 5, communicating with second treating liquid producing section 10 and supplies the second treating liquid QM onto the substrate W from the first direction, and a second supplying section S2 which is provided in the treating section 5, communicating with the second treating liquid producing section 10 and supplies the second treating liquid QM onto the substrate W from the second direction different from the first direction mentioned above.
申请公布号 JP2002205022(A) 申请公布日期 2002.07.23
申请号 JP20010006796 申请日期 2001.01.15
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NAKAGAWA YOSHIYUKI;KAMIYAMA TSUTOMU;YAMASHITA KOJI;FUJII KENJI
分类号 B08B3/02;B08B3/08;H01L21/304;(IPC1-7):B08B3/02 主分类号 B08B3/02
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