发明名称 |
Polishing pad for a linear polisher and method for forming |
摘要 |
A polishing pad for use in a linear polisher, and more specifically, for a linear chemical mechanical polishing apparatus that has improved polishing uniformity is described. The polishing pad is provided with a top surface for engaging a wafer surface to be polished. The top surface has a center portion and two oppositely situated edge portions. The polishing pad is further provided with a multiplicity of voids situated in the top surface of the pad body such that the top surface has a void-to-surface ratio that is greater in the two edge portions than in the center portion of the top surface. The present invention novel polishing pad provides a more uniform polishing across a wafer surface, together with an improved planarity after polishing.
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申请公布号 |
US6422929(B1) |
申请公布日期 |
2002.07.23 |
申请号 |
US20000541070 |
申请日期 |
2000.03.31 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
JANG SYUN-MING;CHEN YING-HO |
分类号 |
B24B21/04;B24B37/04;B24D18/00;(IPC1-7):B24B21/00;B24B11/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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地址 |
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