| 摘要 |
<p>A method is provided for preparing the surface of a resin composite for metal plating. More particularly, a layer consisting essentially of resin is applied to the surface of the composite. Thereafter, the surface of the resin layer is etched, preferably by treatment with an etching solution containing either a quarternary ammonium hydroxide or a primary amine. Upon completion of the etching process, the resin layer may be successfully plated with metal. The method of the invention operates to improve adhesion between the resin composite and a subsequently-plated metal by providing the composite with a homogeneous distribution of mechanical anchoring sites for a subsequently-plated metal, such that uniformity of adhesion is achieved. A cyanate ester resin composite prepared for plating in accordance with the invention may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.</p> |
