| 摘要 |
A thermal binding mechanism for thermal binding of a binding object having a thermal melted glue at one side includes: (a) a rectangular housing for holding with hands, having a recess defining a passage for the binding object to pass through; and (b) a clipping and heating mechanism mounted within the housing to heat and uniformly exert a force onto the binding object, having a first heat source located at the bottom portion of the path, and a pair of second heat source positioned at the two lateral sides of the recess, corresponding to the thermal melted glue of the binding object, thereby the binding object is located between the clipping and heating mechanism and the binding object is allowed to move relatively along the passage via the clipping and heating mechanism.
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