| 发明名称 |
Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method |
| 摘要 |
In a chemical-mechanical polishing machine (101) where a polishing head (100) holds a wafer (150) against a polishing pad (140), a retaining ring (300) that surrounds the wafer (150) has an open chamber (350) to distribute pressurized slurry (144) to the polishing pad (140) and to the periphery (153) of the wafer (150).
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| 申请公布号 |
US6419567(B1) |
申请公布日期 |
2002.07.16 |
| 申请号 |
US20000638725 |
申请日期 |
2000.08.14 |
| 申请人 |
SEMICONDUCTOR 300 GMBH & CO. KG |
发明人 |
GLASHAUSER WALTER |
| 分类号 |
B24B37/00;B24B37/04;B24B57/02;H01L21/304;(IPC1-7):B24B29/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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