发明名称 |
Rigid-printed wiring board and production method of the rigid-printed wiring board |
摘要 |
The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for finning the copper paste, is provided.
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申请公布号 |
US6420017(B1) |
申请公布日期 |
2002.07.16 |
申请号 |
US20000599303 |
申请日期 |
2000.06.22 |
申请人 |
SONY CORPORATION;SHIRATO PRINTED CIRCUIT BOARD CO. LTD. |
发明人 |
MATSUDA YOSHINARI;KOGUCHI TOMOHIDE |
分类号 |
H01L23/498;H05K1/02;H05K1/03;H05K1/11;H05K3/40;(IPC1-7):B32B15/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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