发明名称 Methods of forming portions of transistor structures, methods of forming array peripheral circuitry, and structures comprising transistor gates
摘要 The invention encompasses a method of forming a portion of a transistor structure. A substrate is provided, and a transistor gate is formed over the substrate. The transistor gate has a sidewall. A silicon oxide is deposited over a portion of the substrate proximate the transistor gate by high density plasma deposition. A spacer is formed over the silicon oxide and along the sidewall of the transistor gate. The invention also encompasses a method of oxidizing a portion of a conductive structure. Additionally, the invention encompasses transistor gate structures, as well as structures comprising memory array and peripheral circuitry.
申请公布号 US6420250(B1) 申请公布日期 2002.07.16
申请号 US20000518508 申请日期 2000.03.03
申请人 MICRON TECHNOLOGY, INC. 发明人 CHO CHIH-CHEN;LANE RICHARD H.;DENNISON CHARLES H.
分类号 H01L21/28;H01L21/60;H01L21/768;H01L21/8234;H01L21/8242;(IPC1-7):H01L21/320;H01L21/476 主分类号 H01L21/28
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