| 摘要 |
The present invention provides an apparatus for performing mechanical polishing of a semiconductor wafer surface, including a polishing pad having a polishing face. The polishing pad includes a first member defining a first polishing surface and comprising a structurally degradable abrasive first material, and a surface abrasion impeding second member defining a second polishing surface and comprising a second material that is less degradable and less abrasive than the first material. The apparatus also includes a wafer support having a support surface. The wafer support is disposed opposite to the pad, such that the polishing face and the support surface are substantially parallel and can be brought within close proximity.
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