发明名称 |
Drying apparatus for a substrate and drying method thereof |
摘要 |
Thin substrate plates are transferred in a horizontal or tilted posture on and by a substrate transfer means. Provided by a substrate transfer path is an air knife nozzle for scraping and drying off a liquid successively from surfaces of the substrates on the substrate transfer means. The air knife nozzle is located substantially at a uniform distance across a drying surface of a substrate plate on the transfer means. The air knife nozzle is provided with a slit-like nozzle hole to spurt jet air to the drying surface from an angular direction relative to a direction perpendicular to the substrate transfer direction and to sweep the substrate across the entire width of the drying surface and with a predetermined angle of incidence relative to the substrate transfer direction. Further, an air augmenting means is located in face to face relation with a corner portion of the substrate which is finally swept by the air knife nozzle, for increasing an amount of jet air to purge a liquid which is gathered in the comer portion as a result of the sweeping action of the air jet nozzle.
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申请公布号 |
US6418640(B1) |
申请公布日期 |
2002.07.16 |
申请号 |
US20000579134 |
申请日期 |
2000.05.30 |
申请人 |
HITACHI ELECTRONICS ENGINEERING CO., LTD. |
发明人 |
FUKUDA HIROSHI;YASUIKE YOSHITOMO;GOMMORI KAZUHIKO;ABURADA KUNIO |
分类号 |
G02F1/13;F26B5/00;F26B5/14;F26B21/00;G02F1/1333;H01L21/00;(IPC1-7):F26B3/00 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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