发明名称 Drying apparatus for a substrate and drying method thereof
摘要 Thin substrate plates are transferred in a horizontal or tilted posture on and by a substrate transfer means. Provided by a substrate transfer path is an air knife nozzle for scraping and drying off a liquid successively from surfaces of the substrates on the substrate transfer means. The air knife nozzle is located substantially at a uniform distance across a drying surface of a substrate plate on the transfer means. The air knife nozzle is provided with a slit-like nozzle hole to spurt jet air to the drying surface from an angular direction relative to a direction perpendicular to the substrate transfer direction and to sweep the substrate across the entire width of the drying surface and with a predetermined angle of incidence relative to the substrate transfer direction. Further, an air augmenting means is located in face to face relation with a corner portion of the substrate which is finally swept by the air knife nozzle, for increasing an amount of jet air to purge a liquid which is gathered in the comer portion as a result of the sweeping action of the air jet nozzle.
申请公布号 US6418640(B1) 申请公布日期 2002.07.16
申请号 US20000579134 申请日期 2000.05.30
申请人 HITACHI ELECTRONICS ENGINEERING CO., LTD. 发明人 FUKUDA HIROSHI;YASUIKE YOSHITOMO;GOMMORI KAZUHIKO;ABURADA KUNIO
分类号 G02F1/13;F26B5/00;F26B5/14;F26B21/00;G02F1/1333;H01L21/00;(IPC1-7):F26B3/00 主分类号 G02F1/13
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