发明名称 |
Endpoint detection by chemical reaction |
摘要 |
Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example, ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. The reaction product is extracted as a gas from the slurry and monitored using a threshold photoionization mass spectrometer.
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申请公布号 |
US6419785(B1) |
申请公布日期 |
2002.07.16 |
申请号 |
US20000678633 |
申请日期 |
2000.10.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LI LEPING;GILHOOLY JAMES ALBERT;MORGAN, III CLIFFORD OWEN;WEI CONG;YU CHIENFAN |
分类号 |
B24B37/04;H01L21/3105;(IPC1-7):C23F1/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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