发明名称 |
Full additive process with filled plated through holes |
摘要 |
A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.
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申请公布号 |
US6418616(B2) |
申请公布日期 |
2002.07.16 |
申请号 |
US20010795852 |
申请日期 |
2001.02.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATT ANILKUMAR C.;MARKOVICH VOYA R.;MEMIS IRVING;WILSON WILLIAM E. |
分类号 |
B32B7/04;H01R12/04;H01R12/06;H05K1/03;H05K1/11;H05K3/00;H05K3/04;H05K3/18;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
B32B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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