发明名称 |
Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
摘要 |
A module circuit board for a semiconductor device by a solder reflow process includes a plurality of pads on which the semiconductor device to be mounted, a plurality of terminals formed on a side edge of the board, a resist film covering an area between said pads and said terminal on the board, and a barrier formed between said pads and said terminals.
|
申请公布号 |
US6420658(B1) |
申请公布日期 |
2002.07.16 |
申请号 |
US19990450504 |
申请日期 |
1999.11.30 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TAKAHASHI NORIO |
分类号 |
H05K1/02;H05K1/03;H05K1/11;H05K3/34;H05K13/04;(IPC1-7):H05K1/00;H05K1/16 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|