BONDING PAD OF SEMICONDUCTOR DEVICE HAVING STEP AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A bonding pad of a semiconductor device having a step and a manufacturing method thereof are provided to the adhesion force of a bonding wire and a bonding pad by increasing an adhesion area of the bonding wire and pad. CONSTITUTION: The bonding pad(17) has a contact hole formed by patterning an insulation film(13) at a position to form the bonding pad by using a photoresist etching technology and has a conductive material formed on the contact hole and the insulation film. The step(20) is formed on the surface of the bonding pad. The bonding pad has the contact material between the contact hole and the pad. The step is formed by the contact hole.