发明名称 Apparatus and method for packaging circuits
摘要 The invention relates to a circuit package comprising a module and a socket which cooperate to provide quick and easy insertion of the module into the socket using a small insertion force, accurate alignment between the module and the socket after insertion, and coupling between a module coupling site and a socket coupling site after insertion. A socket guide feature allows an edge of the module to slide along the guide feature during insertion of the module into the socket, and a module alignment feature interlocks with a socket alignment feature-after insertion of the module into the socket. In addition, after insertion of the module into the socket, a retaining feature restricts the motion of the module so that the module coupling site remains in contact with the socket coupling site.
申请公布号 US6419517(B1) 申请公布日期 2002.07.16
申请号 US19990261608 申请日期 1999.02.26
申请人 MICRON TECHNOLOGY, INC. 发明人 MODEN WALTER L.
分类号 H01R12/00;H01R12/18;H01R13/631;H01R13/64;H05K7/14;(IPC1-7):H01R13/64 主分类号 H01R12/00
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