High frequency bi-level offset multi-port jack

摘要

A multi-port modular jack including an outer housing part, inner housing parts arranged in the outer housing part to define plug-receiving receptacles receivable of mating plugs, and an optional shield surrounding the jack. The outer housing part having a top wall, a bottom wall and a front face having a mid-portion arranged substantially parallel to and between the top and bottom walls. The front face defines a first row of apertures between the mid-portion and the top wall and a second row of apertures between the mid-portion and the bottom wall. Each aperture in the first row has a plane of symmetry offset in relation to a plane of symmetry of each aperture in the second row such that only a portion of each aperture in the first row is directly opposite the opposed apertures in the second row. Vents are formed in the outer housing part to allow for the passage of air through the jack. The inner housing parts are arranged in the outer housing part to define the plug-receiving receptacles in alignment with a respective aperture in the front face of the outer housing part. Each inner housing part includes contact/terminal members for engaging contacts of a plug insertable into a respective plug-receiving receptacle. The contact/terminal members forming one or more wire pairs may be provided with a double cross over to reduce near-end crosstalk.