| 摘要 |
PROBLEM TO BE SOLVED: To reduce the time required for the measurement of a gap value to obtain data necessary to keep the height of a nozzle even in many coating positions with solder paste. SOLUTION: In the case of, for example, placing a semiconductor device respectively on placing positions D1-D4 of a substrate surface 7a, a rectangular pad is provided respectively around the placing positions D1-D4 and the solder paste is applied on the pad to connect the terminal of the semiconductor device. In such a case, the gap value from the virtual reference surface to the pad is detected practically using 4 pad positions P1-P4 as detecting positions. The inclination of the reference surface 7a along a correction line T12, T34, T13 or the like of the assumed gap value is determined from the distance between the resultant gap value and the detecting positions P1-P4 and the gap value in the other pad position on the gap value correction line T12, T34 and T13 is determined by computing. The height of the nozzle is adjusted corresponding to the resultant gap value to apply the paste on each pad part.
|
