发明名称 CPU cooling device with a mounting mechanism
摘要 A CPU cooling device with a mounting mechanism has at least one pair of wedge members. The wedge member has a positioning end for passing through a through hole of a vertical plate, a protruding block, a snapping plate for retaining a fixing frame by means of engagement of a distal snapping end on the snapping plate and a flange of the fixing frame, and an embedding plate for locking a radiator by inserting the embedding plate into a groove on a ledge of the radiator.
申请公布号 US6419008(B1) 申请公布日期 2002.07.16
申请号 US20010986848 申请日期 2001.11.13
申请人 NEXTRONICS ENGINEERING CORP. 发明人 WU LEE-JEN
分类号 H01L23/40;H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
主权项
地址