BACKUP METHOD FOR SEMICONDUCTOR EQUIPMENT

摘要

PURPOSE: A backup method for semiconductor equipment is provided to perform a backup process for the semiconductor equipment by using a permanent dummy wafer. CONSTITUTION: A dummy wafer is loaded into a chamber installed within semiconductor equipment(S10). The dummy wafer is formed by metal material. A semiconductor fabrication process for the dummy wafer is performed(S12). The dummy wafer is unloaded from the semiconductor equipment after the semiconductor fabrication process for the dummy wafer is performed(S14). A backup process for the semiconductor equipment is checked after the dummy wafer is unloaded from the semiconductor equipment(S16). A chemical process for the dummy wafer is performed(S18) after the backup process for the semiconductor equipment is performed.