LEAD FRAME AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A lead frame and a semiconductor package using the same are provided to mount easily a semiconductor chip of a large size, perform easily a fabricating process of a lead frame, and improve wire bonding quality in a wire bonding process. CONSTITUTION: The first pad(2) is formed on a rectangular plate. A bent portion(13) is formed at both sides of the first pad(2). The second pad(4) is formed at an end portion of the bent portion(13). The second pad(4) has a shape of rectangular ring in order to cover the first pad(2). A plurality of ground leads(6) are extended from one side of the second pad(4) to an outside. A plurality of signal leads(8) are located at the other side of the second pad(4). The ground leads(6) and the signal leads(8) are connected to each other by a dam bar(10). The dam bar(10) is connected with a frame(12). Accordingly, the second pad(4) is formed on the first pad(2) and the ground leads(6) and the signal leads(8) are formed on the same layer of the second pad(4).