发明名称 IMPREGNATED CATHODE STRUCTURE AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an impregnated cathode structure and its manufacturing method capable of joining a porous base metal with a cup-shaped member strongly without interposing anything, allowing elimination of poor welds, and enhancing the reliability and yield of the welds generated between the porous base metal and cup-shaped member. SOLUTION: The impregnated cathode structure is composed of the porous base metal 11 impregnated with an electron emitting substance and the cup- shaped member 12 to hold the metal 11 in such a way as covering its bottom, surface and side faces while the obverse surface is left exposed. In the structure, a dense part 14 not porous is formed on the bottom surface of the metal 11, and the bottom of the cup-shaped member 12 is deformed by pressure as tracing the shape of the dense part 14 so that a tight attaching region 16 is formed, and by this tight attaching region 16, the bottom of the cup-shaped member 12 is welded to the dense part 14 of the metal 11.</p>
申请公布号 JP2002197964(A) 申请公布日期 2002.07.12
申请号 JP20000396980 申请日期 2000.12.27
申请人 SONY CORP 发明人 IMABAYASHI HIROTOMO
分类号 H01J1/28;H01J9/04;(IPC1-7):H01J1/28 主分类号 H01J1/28
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