| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board for inhibiting the drop of a mounted component from the electrode of a substrate, in the manufacturing method of the printed wiring board having the component mounting electrode of a narrow pitch. SOLUTION: In the printed wiring board, a metallic conductor layer 12 having a rectangular cross section is formed on the upper side of a conductor pattern 5 having a trapezoidal cross section, which is formed on an insulating substrate. The width of the metallic conductor layer is larger than the width of the upper side of the conductor pattern 5 having the trapezoidal cross section. Since allowance on dislocation at the time of mounting the component becomes large, the superior printed wiring board effective for the suppression of a contact failure can be realized.</p> |
